Samsung Electronics stock rose as much as 6.51% after the company announced that it has started shipping samples of its latest high-bandwidth memory chips to customers around the world.
Samsung’s 12-layer HBM4E chip is an industry first, the company says, and can reach speeds of up to 16 Gbit/s with “improved energy efficiency and thermal performance.”
High-bandwidth memory chips (Samsung, SK Hynix, and micron Used in advanced artificial intelligence systems. These help processors quickly process large amounts of data required for AI accelerators such as: NvidiaRubin and Google’■ Ironwood Tensor processing unit.
Samsung’s 12-layer HBM4E has vertically stacked dynamic random access memory and has a capacity of 48 gigabytes, an increase of more than 30% compared to the previous generation, the company said in a press release.
The South Korean chipmaker added that it plans to expand its lineup to include an 8-layer 32GB configuration and a 16-layer 64GB configuration, depending on customer requirements.
“Through our advanced manufacturing capabilities and pre-emptive infrastructure investments, we will continue to drive the growth of the global AI memory market,” said Sang Jun Hwang, executive vice president and head of memory development at Samsung Electronics.
The news comes after Samsung started shipping HBM4 chips to customers in February, aiming to close the gap with SK Hynix and strengthen its position in the next-generation AI memory market.
The latest stock price was traded at 310,500 won, an increase of 3.67%.
